Herstellung von III-V-Verbindungshalbleitern mit Loesungszonen
Engineering problems and the trade offs in the design of high technology devices
A monolithic voltage regulator for automotive electronic systems
Effective electromagnetic shielding in multilayer printed circuit boards
New component development for multi-100 kW low-cost solar array applications
New automotive sensor solid state technologies part II
Integral solar cell covers by plasma activated CVD
Development of AlGaAs/GaAs solar cells with space qualifications
Electronic packaging module evolution from a material and process perspective
Emissivity enhancement of fused silica for space applications
The role of color television in target detection and recognition
Hybrids and surface mounted devices for space application: The European scenario
Review of mantech program for GaAs solar cells
Stand und Entwicklungstendenzen der Dickschichttechnik in der Kraftfahrzeugbranche
The MIMIC Program-key to affordable MMICs for DoD systems
Qualified manufacturer's list (QML)-a new approach for qualifying ASICs
Integrated circuit impact on millimeter wave sensors
TAB interconnect in high performance ceramic packages for military applications
High-reliability silver-bearing thick film conductors for automotive applications
Sensor technology for accelerometer applications
Entwicklungstendenzen in Halbleiterprozessen für die Automobilelektronik
Advanced III-V materials processing in the vacuum of space
Millimeter radar: current assessment, future directions
Millimeter wave MMIC technology for smart weapons
A self-diagnostic airbag accelerometer with skew-symmetric proof-mass
A comparison of semiconductor technologies used in display fabrication
Thin-film-edge emitter vacuum microelectronics devices for lamp/backlight applications
Hydrogen degradation of GaAs MMICs and hydrogen evolution in the hermetic package
A smart automotive accelerometer with on-chip airbag deployment circuits