Electronic packaging module evolution from a material and process perspective

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Electronic packaging module evolution from a material and process perspective

Lussow, R.G.

Packaging Technology developments have been an important part of the success of the Computer Industry's ability to provide ever increasing cost effective performance and reliability in information processing. This paper will review the product and technology development history of one aspect of system packaging, the first level package or module. The IBM Ceramic Module History will be used to illustrate product, material, and process developments of the past several years.

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Title :

Electronic packaging module evolution from a material and process perspective

Additional title:

Entwicklung von elektronischen Kompaktbaumodulen aus der Material- und Fabrikationsperspektive

Contributors:

Lussow, R.G. (author)

Published in:

Int. Congress on Transportation Electronics Proc., 1984 ; 6-14

Publication date :

1984

Size :

8 Seiten, 24 Bilder, 13 Quellen

Type of media :

Conference paper

Type of material :

Language :

English

Keywords :

HALBLEITERTECHNOLOGIE , HALBLEITERGEHAEUSE , FERTIGUNGSVERFAHREN , MODULBAUWEISE , MODUL , ZUVERLAESSIGKEIT , KOMPAKTBAUWEISE , MATERIALFORSCHUNG , ENTWICKLUNGSSTAND

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