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Synonyms were used for: encapsulation
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    Future developments on submarine cables and systems

    Reinaudo, C. / Libert, J.F. | Tema Archive | 1994
    Keywords: druckfeste Kapselung

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archive | 1998
    Keywords: Wärmehaushalt (Kapselung)

    A Frame-Related Approach for Performance Improvement of MPE-FEC in DVB-H

    Liu, Rongke / Wang, Yan / Zhang, Yanzhong | Springer Verlag | 2021
    Keywords: Multi-Protocol Encapsulation Forward Error Correction (MPE-FEC)

    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archive | 2003
    Keywords: Einkapselung

    A case history in power generation

    Ley, D.E. | Tema Archive | 1985
    Keywords: KAPSELUNG

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archive | 1998
    Keywords: Verkapseln

    A Critical Review on Assessment of Self Healing Performance of Bioconcrete

    Soda, Prabhath Ranjan Kumar / Mini, K. M. | Springer Verlag | 2023
    Keywords: Encapsulation procedure

    Application research on a grinding robot system - grinding of rolling stock parts

    Yoshimi, T. / Jinno, M. / Taguchi, T. et al. | Tema Archive | 1993
    Keywords: Kapselung

    Reliability assessment of molded Smart Power Modules

    Thomas, Tina / Becker, Karl-Friedrich / Dijk, Marius van et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010
    Keywords: Einkapselung

    Microencapsulation of Drugs in the Microgravity Environment of the United States Space Shuttle

    T. R. Tice / R. J. Holl | NTIS | 1991
    Keywords: Encapsulation

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Incendivity of electrical sparking due to circulating currents in the enclosures of large electrical machines

    Bartels, A.L. / Bradford, M. / Thompson, M.G. | Tema Archive | 1988
    Keywords: DRUCKFESTE KAPSELUNG

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Improved Therapy of Experimental Leishmaniasis by Use of a Liposome-Encapsulated Antimonial Drug

    C. R. Alving / E. A. Steck / W. L. Hanson et al. | NTIS | 1978
    Keywords: Encapsulation

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archive | 1997
    Keywords: Verkapseln

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archive | 1993
    Keywords: Kapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Evaluation Polyurethane Elastomeric Compound Cps-796-65, Type II

    R. H. Flack | NTIS | 1966
    Keywords: Encapsulation

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)

    Tema Archive | 1979
    Keywords: KAPSELUNG

    Evaluation Polyurethane Elastomeric Compound Uralane 5712, Type III

    R. H. Flack | NTIS | 1966
    Keywords: Encapsulation

    Underwater Locator Beacon Detection Ranges for Fuselage Encapsulated Recorders

    R. B. Fisher / P. M. Rich | NTIS | 1968
    Keywords: Encapsulation

    An Assessment of Small Submarines and Encapsulation of Ballistic Missiles--Phase II Survey

    NTIS | 1980
    Keywords: Encapsulation

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Development of Improved Sterilizable Potting and Encapsulating Compounds for Space Applications Second Annual Summary Report, 1 Jul. 1964 - 30 Jun. 1965

    N. Bilow | NTIS | 1965
    Keywords: Encapsulation

    Encapsulation, Electronics, Eccofoam

    F. N. Le Doux | NTIS | 1965
    Keywords: Encapsulation

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Structural Design of Pavements for Light Aircraft

    D. M. Ladd / F. Parker / A. T. Pereira | NTIS | 1976
    Keywords: Encapsulation

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    300 ampere, 1000 volt hermetic Darlington transistor

    Morozowich, M. | Tema Archive | 1989
    Keywords: DRUCKFESTE KAPSELUNG

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Integrated Power Amplifier Final Report, Mar. 1964 - Sep. 1965

    T. C. New | NTIS | 1965
    Keywords: Encapsulation

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Alvin-120 VDC/28 VDC electrical system

    Hosom, D.S. / Forrester, N.C. / Walden, B.B. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Submarine Horizontal Launch TACTOM Capsule

    J. C. Callahan | NTIS | 2001
    Keywords: Encapsulation

    Direct glassing of silicon space solar cells: approach and manufacturing experiences

    Koch, J.W. / White, P.A. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Demonstrated reliability of plastic-encapsulated microcircuits for missile applications

    Sun Man Tam | Tema Archive | 1995
    Keywords: Kapselung

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Warm Fog Modification Studies

    T. B. Smith | NTIS | 1971
    Keywords: Encapsulation

    Decontamination of the Aimp-D Spacecraft

    F. N. Le Doux | NTIS | 1967
    Keywords: Encapsulation

    Stackable In-Line Underwater Missile Launch System for a Modular Payload Bay

    M. T. Ansay | NTIS | 2004
    Keywords: Encapsulation

    Trial of Noise-Reduced Diesel-Powered Vehicles in Practical Use. Final Report

    W. Haerting / W. Voehringer / G. Horn et al. | NTIS | 1985
    Keywords: Encapsulation

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