Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications
Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications
- New search for: Fabbri, G.
- New search for: Sartori, C.
- New search for: Scarano, G.
- New search for: Fabbri, G.
- New search for: Sartori, C.
- New search for: Scarano, G.
The importance of the presence of underfill in flip chip technology bumped on high Tg (glass transition temperature) HDI PCB (high density interconnection printed circuit board) is checked. Three different underfills are compared in term of stress distribution at ambient and at high temperature, and in term of mechanical reliability after thermal aging by means of C-SAM, microsections, SEM and electrical resistance measurements. Thermal fatigue tests are performed in order to reproduce environmental conditions typical of use in automotive electronics. Different behaviours of the three underfills are found but no failures are detected.
Document information
Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications
The International Journal of Microcircuits and Electronic Packaging ; 24 , 4 ; 405-420
2001
16 Seiten, 8 Quellen
Article (Journal)
English
Ultraschallmikroskopie , Altern (Werkstoff) , Kraftfahrzeugelektronik , Widerstand (elektrische Größe) , Glasbildung , Verbindung integrierter Schaltungen , Halbleitergehäuse , integrierte Schaltung , Zuverlässigkeit , Prüfung integrierter Schaltungen , Rasterelektronenmikroskopie , Rasterelektronenmikroskop , Kraftwagen , Glasübergang , Flip-Chip-Bauelement
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