Systems, methods, and apparatus for passive cooling of UAVs

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Systems, methods, and apparatus for passive cooling of UAVs

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WANG PENG / LE DON / ANDERSON JON JAMES / CHIU CHINCHUAN

An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

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Title :

Systems, methods, and apparatus for passive cooling of UAVs

Contributors:

WANG PENG (author) / LE DON (author) / ANDERSON JON JAMES (author) / CHIU CHINCHUAN (author)

Publication date :

2024-05-07

Type of media :

Patent

Type of material :

Electronic Resource

Language :

English

Classification :

IPC:

B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / B64C AEROPLANES , Flugzeuge / B64U / F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT