SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS

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SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS

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WANG PENG / LE DON / ANDERSON JON / CHIU CHINCHUAN ANDREW

An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

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Title :

SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS

Additional title:

SYSTEME, VERFAHREN UND VORRICHTUNG ZUR PASSIVEN KÜHLUNG VON UAVS
SYSTÈMES, PROCÉDÉS ET APPAREIL DE REFROIDISSEMENT PASSIF D'UAV

Contributors:

WANG PENG (author) / LE DON (author) / ANDERSON JON (author) / CHIU CHINCHUAN ANDREW (author)

Publication date :

2024-01-17

Type of media :

Patent

Type of material :

Electronic Resource

Language :

English

Classification :

IPC:

F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT / B64U