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encapsulation
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Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
A Novel Technology for Thermal Control for ISP module for Space Applications
Novel component packaging for high current applications using power semiconductor devices
Design limitations of powertrain electronics - automotive EMC challenges
Test method for availability of holes in height - temperature barrier on cementation process
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Metal-enclosed, air-insulated traction switchgear - developments and applications
Reliability potential of epoxy based encapsulants for automotive applications
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
An improved, linear homopolar, electromagnetic launcher: STAR
Thermal characterization of a mercury arc lamp for a projection display system
New method for electrothermal simulations: HDTMOS in automotive applications
The changing automotive environment: high-temperature electronics
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
High temperature, high power density packaging for automotive applications
Model for BGA and CSP reliability in automotive underhood applications
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Optimized cooling systems for high-power semiconductor devices
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Assessment of high-heat-flux thermal management schemes
Thermal management for high performance computing in spaceborne applications
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Memory chip packaging-an enabling technology for high-performance recce systems
MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)