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encapsulation
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Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler
Multilayer alumina substrates for ECU (automotive electronics)
3-layered 3D flex based MCM: electrical characterization and reliability issues
Variable emissivity through MEMS technology
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Accelerated testing of flip chip packages under dynamic load