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    A commute advisory system. II. Performance evaluation

    Kher, S. / Tokekar, S.V. / Chande, P.K. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Advanced real-time embedded system tools for intelligent architectures (ARTESIA)

    Harrelson, M. / Zaleta, D. / Ballard, D. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    A framework for integrating design automation with computer aided parametric estimating (CAPE)

    Walter, T.J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Air traffic control trainer software development: multi-agent architecture and Java prototype

    Peters, J.F. / Agatep, R. / Cormier, S. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Analytical tools for the management of faster-better-cheaper space missions

    Pate-Cornell, E. / Dillon, R. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    An innovative fully automatic facility in welding process: the erection state in the railway construction industry, where auxiliary operations are carried out automatically and a relevant improvement is assured to the working environment

    Berthold, W. / Bisiach, B. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    An original correlation and data fusion based approach to detect a reap limit into a gray level image

    Chateau, T. / Berducat, M. / Bonton, P. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    An overview of the VITAL program

    Hodges, W.D. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    A powertrain control SOI BiCMOS LSI for an automotive application

    Hattori, M. / Kuromiya, S. / Itoh, F. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Applying software process to Virtual Instrument based test program set development

    Rabe, D. / Miller, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    A predictive model for urban air pollution evaluation

    Ando, B. / Baglio, S. / Graziani, S. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Assembly issues in replacing a high cost hermetically sealed hybrid with a low cost non-hermetic assembly for prolonged use at 180 degrees C

    Whitehurst, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Assembly reliability of Ball Grid Array and chip scale packages for high reliability applications

    Ghaffarian, R. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    A status of the United States Air Force's More Electric Aircraft initiative

    Cloyd, J.S. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    ATS in the Air Force: the legacy and its challenges

    Holm, D. / Haffarnan, J. / Dean, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Blending borescope inspection (BBI) maintenance service equates to cost savings

    Adair, T.L. / Owens, J.L. / Grady, G. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Characterization and reliability of conductive ink/polymer filled microvias

    Mobley, W.M. / Derflinger, T.E. / Parker, R.D. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    COTS fiber optic interconnect solutions for mobile platforms

    Horwitz, D. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Designing for determinism: lessons learned from modern real-time avionics applications

    Preston, J.D. / Kegley, R.B. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Detection and classification of subsurface objects in a marine environment by the use of a lidar system

    Cianciotto, F.T.P. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Development of a prognostics and health management capability for the Joint Strike Fighter

    Smith, G. / Schroeder, J.B. / Navarro, S. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Driver state prediction from vehicle signals: An evaluation of segmentation approaches

    Free access
    Maritsch, Martin / Koch, Kevin / Thomsen, Hauke et al. | BASE | 2022
    Publisher: Institute of Electrical and Electronics Engineers , KITopen (Karlsruhe Institute of Technologie)

    Economics of diagnosis

    Ambler, A.P. / Bassat, M.B. / Ungar, L.Y. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Enhanced fault management for future IMA systems

    Wilcock, G.W. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    EUROMAR-MERMAID: experimental operation of the prototype network

    Knauth, H.D. / Schroeder, F. / Kohnke, D. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Evaluation of advanced automotive electrical system architectures using MAESTrO

    Afridi, K.K. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Evaluation of diffusion patterning as an alternative substrate technology for automotive applications

    Xue, J. / Baker, T. / Klosowiak, T. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Experimental application of digital PD measurements to the diagnostics of railway system drives insulating systems

    Centurioni, L. / Coletti, G. / Guastavino, F. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Experiments in autonomous underground guidance

    Scheding, S. / Nebot, E.M. / Stevens, M. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Extension of secure audio and video data from the NTC through the public switched telephone network

    Main, P.M. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Failure Investigation/Evaluation System and Technical Aides (FIESTA)

    Davis, R.J. / Harrison, J. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    FMEA for multiple failures

    Price, C.J. / Taylor, N.S. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Fostering collaboration in systems of systems

    Geddes, N.D. / Smith, D.M. / Lizza, C.S. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

    Conway, C.M. / Hagge, J.K. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Implementation of a 'perfect launch' process to improve the effectiveness of automotive new product ramps

    Hempleman, G.L. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Improved performance of p/n InP solar cells

    Hoffman, R.W. jun. / Fatemi, N.S. / Jenkins, P.P. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Incremental avionics upgrades for legacy aircraft

    Nelson, J. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Integrating the cost of satellite sensors and payloads in the space systems architecture decision making process

    Purvis, C.W. / Butterworth, M.L. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    JSF affordable avionics study

    Groat, J. / Sawamura, B. / Spiers, B. et al. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    LCCA-life cycle cost analysis

    Riedel, T. / Tiemann, N. / Wahl, M.G. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Mars Global Surveyor mission assurance: key approaches for faster, better, cheaper missions

    Clark, K.P. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Mechanical properties of iron-cobalt alloys for power applications

    Fingers, R.T. / Coate, J.E. / Dowling, N.E. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Microtechnology for space systems

    Janson, S. / Helvajian, H. / Amimoto, S. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Model abstraction techniques: an intuitive overview

    Sisti, A.F. / Farr, S.D. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archive | 1998
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Multilevel simulation of force XXI fire support operations

    Hamilton, J.A. / Sobiesk, E.J. / Deal, J.C. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Phenomenology of integrated avionics and the currently fielded aircraft market

    Minges, M. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

    Practical and theoretical considerations when integrating linear programming and multi-attribute utility theory: US Army value added analysis

    Pudwill, R. / Coblentz, L.M. / Maxwell, D.T. | Tema Archive | 1997
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York

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