Virtual Instrument (VI) based test program development systems, as exemplified by National Instruments' LabVIEW, provide very powerful design capture fools that allow the test program set (TPS) developer to rapidly prototype test strategies. As usual, in great power lies danger. In this case the danger is the ease of which VIs are reused. While code reuse is a desired feature, unintentional modifications to common VIs, name clashes, and library corruption are all potential headaches resulting from uncontrolled changes to VIs stored in shared libraries. Undetected "Spontaneous Upgrades" to library components can ruin a maintainer's day when the program loads with broken wires. Developing quality software requires software quality. This paper provides recommended practices to address the Key Practice Areas (KPAs) defined in the Software Engineering Institute's (SEI) Capability Maturity Model (CMM) in the context of TPS development in LabVIEW. Repository management procedures such as check-in check-out and change tracking and documentation are described.


    Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Applying software process to Virtual Instrument based test program set development


    Contributors:
    Rabe, D. (author) / Miller, J. (author)


    Publication date :

    1997


    Size :

    4 Seiten, 4 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Applying virtual reality to teach the software development process to novice software engineers

    Gulec, Ulas / Yilmaz, Murat / Isler, Veysi et al. | BASE

    Free access


    Virtual Instrument Test Architecture

    Tondre | Online Contents | 1995


    VLSTA: virtual instrument standard test architecture

    Tondre, H. / Bernal, A. / Valle, J. | IEEE | 1995


    Efficient Software Development Applying a Model - Based Concept

    Przymusinski, Achim / Hopfner, Andreas / Roduner, Christian et al. | SAE Technical Papers | 2013