Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–20 of 93 hits
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    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Comparison and Application of High Prestress and Intensive Support System in Close, Soft and Cracked Roadway Support

    Hu, Bin / Kang, Hong-Pu / Lin, Jian | Tema Archive | 2012
    Keywords: Einkapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    Ein neuer Außengeräuschprüfstand im Entwicklungsprozess bei BMW

    Finsterhoelzl, Herbert | Tema Archive | 2006
    Keywords: Verkapseln

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Kapselung des Kraftaggregates der Automobile des Automobilwerkes Minsk

    Gauchstejn, I.S. / Korsakov, V.V. / Kunovskij, E.B. et al. | Tema Archive | 2003
    Keywords: Kapselung

    Akustik- und Schwingungskomfort des neuen BMW 5er

    Thoma, G. / Bersiner, F. | Tema Archive | 2003
    Keywords: Kapselung

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung