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Variable emissivity through MEMS technology
UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials
Trockene MKK-Kondensatoren für moderne Schienenfahrzeuge
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
The changing automotive environment: high-temperature electronics
Test method for availability of holes in height - temperature barrier on cementation process
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Satellite X4: The 100-element self-scanned photodiode array experiment
Reliability potential of epoxy based encapsulants for automotive applications
Reliability considerations for switched mode power supplies for use in railway applications
Reduction in size and weight of electronic modules through the evolution of packaging design
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
PV degradation curves: non‐linearities and failure modes
Purchase Description Transformer and Inductors for Use in Air Launched Guided Missiles
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Performance of new silicone adhesives and encapsulants at high and low temperatures
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Optimized cooling systems for high-power semiconductor devices
Novel composites for space microelectronics and optics
Novel component packaging for high current applications using power semiconductor devices
Non-hermetic embedded MCM technologies for automotive and other lower cost applications
Niederspannungsschaltanlagen in stoerlichtbogenfester Ausfuehrung fuer Offshore-Anwendung
New techniques and thermoplastics for encapsulating automotive sensors and solenoids