Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–50 of 114 hits
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    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials

    Witteck, Robert | Online Contents | 2017
    Keywords: encapsulation materials

    Trockene MKK-Kondensatoren für moderne Schienenfahrzeuge

    Vetter, H. | Tema Archive | 1997
    Keywords: druckfeste Kapselung

    Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)

    Sattler, P.K. / Thoren, F. | Tema Archive | 1984
    Keywords: DRUCKFESTE KAPSELUNG

    Thermal modeling of secondary lithium batteries for electric vehicle/hybrid electric vehicle applications

    Al-Hallaj, S. / Selman, J.R. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archive | 2005
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management for high performance computing in spaceborne applications

    Samson, J.R. jun. / Cutting, F.M. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Thermal control systems for pod-mounted avionics

    Swain, E.F. / Letton, G.C. jun. | Tema Archive | 1979
    Keywords: VERKAPSELN

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    Snap-50/Spur

    D. R. Basel / R. W. Briggs / C. M. Gauthier et al. | NTIS | 1966
    Keywords: Encapsulation

    Silicon sensors for automotive applications

    Rouet, J.P. / Grandjean, G. | Tema Archive | 1993
    Keywords: Kapselung

    Siedekuehlung fuer Fahrzeugstromrichter

    Wiegner, G. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Selecting enclosures for offshore usage

    Deavin, I. | Tema Archive | 1984
    Keywords: KAPSELUNG

    Satellite X4: The 100-element self-scanned photodiode array experiment

    Brookman, A.K. / Pearson, M.J. | Tema Archive | 1974
    Keywords: KAPSELUNG

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Reliability assessment of molded Smart Power Modules

    Thomas, Tina / Becker, Karl-Friedrich / Dijk, Marius van et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Reduction in size and weight of electronic modules through the evolution of packaging design

    Bergamaschi, G. / Bettini, R. | Tema Archive | 1997
    Keywords: Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    PV degradation curves: non‐linearities and failure modes

    Jordan, Dirk C | Online Contents | 2017
    Keywords: Encapsulation

    Prediction of thermal performance of wire-bonded plastic ball grid array package for underhood automotive applications

    Ramakrishna, K. / Trent, J.R. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archive | 1991
    Keywords: KAPSELUNG

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles

    Beckedahl, P. / Tursky, W. / Scheuermann, U. | Tema Archive | 2005
    Keywords: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Optimierung des Strömungsgeräusches von PKW-Generatoren. Ein Beitrag zur Senkung der Schallemission des Antriebsaggregates

    Lutz, H.J. / Bürger, K.G. / Hackett, D. et al. | Tema Archive | 1995
    Keywords: Verkapseln

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Novel component packaging for high current applications using power semiconductor devices

    Weigeber, Volker / Hayes, Montry B. / Campbell, Robert J. et al. | Tema Archive | 2009
    Keywords: verbesserte Einkapselung

    Non-hermetic embedded MCM technologies for automotive and other lower cost applications

    Fillion, R. / Wojnarowski, R. | Tema Archive | 1993
    Keywords: Kapselung , nichthermetische Kapselung

    Niederspannungsschaltanlagen in stoerlichtbogenfester Ausfuehrung fuer Offshore-Anwendung

    Buehrer, B. / Chrobak, E. | Tema Archive | 1987
    Keywords: DRUCKFESTE KAPSELUNG

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archive | 1993
    Keywords: Kapselung

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)