Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–20 of 23 hits
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    Mechanical Properties of Steel Encapsulated Metal Matrix Composites

    Fudger, Sean / Klier, Eric / Karandikar, Prashant et al. | Wiley | 2015
    Keywords: Encapsulation

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archive | 2001
    Keywords: Verkapseln

    1990's whispering giants

    Mitchell, C. | Tema Archive | 1985
    Keywords: VERKAPSELN

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archive | 1997
    Keywords: Einkapselung

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archive | 1978
    Keywords: KAPSELUNG

    P/M titanium reduces aerospace component costs

    Andersen, P.J. / Alber, N.E. / Thellmann, E.L. | Tema Archive | 1980
    Keywords: VERKAPSELN

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archive | 1991
    Keywords: KAPSELUNG

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archive | 2003
    Keywords: Einkapselung

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archive | 1998
    Keywords: Verkapseln

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archive | 1993
    Keywords: Kapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)