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UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials
PV degradation curves: non‐linearities and failure modes
Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments
Intelligent energy management for a parallel hybrid electric vehicle in customer use
Encapsulations for organic devices and their evaluation using calcium corrosion tests
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
A Novel Technology for Thermal Control for ISP module for Space Applications
Novel component packaging for high current applications using power semiconductor devices
Design limitations of powertrain electronics - automotive EMC challenges
Test method for availability of holes in height - temperature barrier on cementation process
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Metal-enclosed, air-insulated traction switchgear - developments and applications
Reliability potential of epoxy based encapsulants for automotive applications
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
An improved, linear homopolar, electromagnetic launcher: STAR
Thermal characterization of a mercury arc lamp for a projection display system
New method for electrothermal simulations: HDTMOS in automotive applications
The changing automotive environment: high-temperature electronics
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
High temperature, high power density packaging for automotive applications
Model for BGA and CSP reliability in automotive underhood applications
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Optimized cooling systems for high-power semiconductor devices
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Assessment of high-heat-flux thermal management schemes