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Synonyms were used for: encapsulation
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    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Simulation der thermischen Ankopplung von glasgekapselten Temperatursensoren an die Wicklung von elektrischen Maschinen

    Hegner, Holger / Riedler, Johann | Tema Archive | 2008
    Keywords: Kapselung

    Embedded training: Can it be done with mirrors?

    Darfus, G.H. | Tema Archive | 1986
    Keywords: KAPSELUNG

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    Reliability assessment of codlag system

    Tema Archive | 1985
    Keywords: VERKAPSELN

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archive | 1998
    Keywords: keramische Kapselung , Wärmehaushalt (Kapselung)

    Les transistors bipolaires hyperfrequences RTC

    Villegas, A. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    Optimierte Motorkapselung fuer laermarme Kraftfahrzeuge. Schalltechnische, werkstofftechnische und wirtschaftliche Aspekte

    Schilling, H. | Tema Archive | 1986
    Keywords: VERKAPSELN

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archive | 2007
    Keywords: Verkapseln

    Definition der Kriterien fuer laermarme Nutzfahrzeuge mit laermrelevanten Zusatzaggregaten - Tankfahrzeuge

    Goesslinghoff, L. / Pauls, H. | Tema Archive | 1986
    Keywords: VERKAPSELN

    Acoustic benchmark of different CO2 encapsulation strategies: Application examples and methods for the design of powertrain encapsulations

    Bertolini, C. / Caprioli, D. / Horak, J. et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse

    Vos, P.H. de | Tema Archive | 1986
    Keywords: VERKAPSELN

    Thesound reduction index applied to automotive problems

    Duvigneau, Fabian / Gabbert, Ulrich | Tema Archive | 2014
    Keywords: Einkapselung

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Aufwendiges Tuning für den Ex-Schutz. Flurförderzeuge

    Tema Archive | 1996
    Keywords: Kapselung

    Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler

    Bachmann, O. | Tema Archive | 1997
    Keywords: Verkapseln

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archive | 1997
    Keywords: Verkapseln

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)

    Tema Archive | 1979
    Keywords: KAPSELUNG

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Demonstrated reliability of plastic-encapsulated microcircuits for missile applications

    Sun Man Tam | Tema Archive | 1995
    Keywords: Kapselung

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

    Conway, C.M. / Hagge, J.K. | Tema Archive | 1998
    Keywords: Verkapseln

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