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Synonyms were used for: encapsulation
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    Encapsulation, Electronics, Eccofoam

    F. N. Le Doux | NTIS | 1965
    Keywords: Encapsulation

    Ejection Apparatus

    A. M. Stott | NTIS | 1966
    Keywords: Encapsulation

    Evaluation Polyurethane Elastomeric Compound Cps-796-65, Type II

    R. H. Flack | NTIS | 1966
    Keywords: Encapsulation

    Evaluation Polyurethane Elastomeric Compound Uralane 5712, Type III

    R. H. Flack | NTIS | 1966
    Keywords: Encapsulation

    Decontamination of the Aimp-D Spacecraft

    F. N. Le Doux | NTIS | 1967
    Keywords: Encapsulation

    Underwater Launched Missile System Canister Design

    W. H. Hine / E. F. Wallace | NTIS | 1969
    Keywords: encapsulation

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archive | 1978
    Keywords: KAPSELUNG

    Research project for reducing the noise of truck Diesel engines

    Feitzelmayer, K.F. / Schroeder, W. | Tema Archive | 1979
    Keywords: KAPSELUNG

    Concept for a chassis mounted capsule of engine and gearbox for heavy trucks

    Krisper, G.K. / Kratochwill, H.H. | Tema Archive | 1979
    Keywords: KAPSELUNG

    Some aspects concerning noise reduction on diesel passenger cars

    Charzinski, H.P. / Hiereth, H. | Tema Archive | 1979
    Keywords: KAPSELUNG

    Some aspects concerning noise reduction of passenger cars with diesel and gasoline engines

    Hiereth, H. / Charzinski, H.P. | Tema Archive | 1979
    Keywords: VERKAPSELN

    Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)

    Tema Archive | 1979
    Keywords: KAPSELUNG

    P/M titanium reduces aerospace component costs

    Andersen, P.J. / Alber, N.E. / Thellmann, E.L. | Tema Archive | 1980
    Keywords: VERKAPSELN

    Applications of pre-packaged wheel bearing assemblies

    Carlisle, J.W. | Tema Archive | 1981
    Keywords: VERKAPSELN

    Development of self-contained hycraulic valve lifter

    Sigiura, A. / Sato, K. / Yamada, K. et al. | Tema Archive | 1983
    Keywords: KAPSELUNG

    Selecting enclosures for offshore usage

    Deavin, I. | Tema Archive | 1984
    Keywords: KAPSELUNG

    Engine encapsulation on 6-10 ton-trucks

    Stiglmaier, M. / Drewitz, H.J. | Tema Archive | 1985
    Keywords: VERKAPSELN

    Reliability assessment of codlag system

    Tema Archive | 1985
    Keywords: VERKAPSELN

    1990's whispering giants

    Mitchell, C. | Tema Archive | 1985
    Keywords: VERKAPSELN

    Embedded training: Can it be done with mirrors?

    Darfus, G.H. | Tema Archive | 1986
    Keywords: KAPSELUNG

    Compact Car: Drive Concept 1990. Final Report

    NTIS | 1987
    Keywords: Encapsulation

    Shipboard noise reduction: Design and application of resilient mounting and acoustic enclosure for diesel engines

    Sacchi, F. | Tema Archive | 1989
    Keywords: Verkapseln

    Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation

    Drewitz, H. / Stiglmaier, M. | Tema Archive | 1989
    Keywords: KAPSELUNG

    Turnkey processes for window encapsulation

    Zarantonello, A. | Tema Archive | 1990
    Keywords: VERKAPSELN

    Silent power transmission systems for modern ships

    Gerstner, J. / Gallin, C. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Microencapsulation of Drugs in the Microgravity Environment of the United States Space Shuttle

    T. R. Tice / R. J. Holl | NTIS | 1991
    Keywords: Encapsulation

    Application research on a grinding robot system - grinding of rolling stock parts

    Yoshimi, T. / Jinno, M. / Taguchi, T. et al. | Tema Archive | 1993
    Keywords: Kapselung

    Pneumatic capsule pipeline at Akima

    Kennedy, A. | Tema Archive | 1994
    Keywords: Verkapseln

    Demonstrated reliability of plastic-encapsulated microcircuits for missile applications

    Sun Man Tam | Tema Archive | 1995
    Keywords: Kapselung

    Der Weg zum leisen Fahrzeug

    Leinfellner, H. / Sommer, D. / Leiter, K. | Tema Archive | 1996
    Keywords: Kapselung

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archive | 1996
    Keywords: Kapselung

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archive | 1997
    Keywords: Einkapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archive | 1998
    Keywords: keramische Kapselung , Wärmehaushalt (Kapselung)

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archive | 1998
    Keywords: Wärmehaushalt (Kapselung)

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archive | 1998
    Keywords: Verkapseln

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Microwave multichip modules using low cost microwave chip on flex packaging technology

    McNulty, M. / Schnell, J. / Nixon, D. | Tema Archive | 1998
    Keywords: Verkapseln

    Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

    Conway, C.M. / Hagge, J.K. | Tema Archive | 1998
    Keywords: Verkapseln

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    Cooling diesel engine exhaust gases using longitudinally finned tubes in a compact jacketed heat exchanger

    Taborek, J. / Yokell, S. | Tema Archive | 1999
    Keywords: Kapselung

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

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