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Synonyms were used for: encapsulation
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    Development and application of microcapsule for cement hydration control

    Choi, Young Cheol / Cho, Young Keun / Shin, Kyung-Jun et al. | Springer Verlag | 2016
    Keywords: encapsulation

      Development and application of microcapsule for cement hydration control

      Choi, Young Cheol / Cho, Young Keun / Shin, Kyung-Jun et al. | Online Contents | 2016
      Keywords: encapsulation

    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archive | 2005
    Keywords: Wärmehaushalt (Kapselung)

    A numerical investigation of thermal engine encapsulation concept for a passenger vehicle and its effect on fuel consumption

    Minovski, Blago / Andrić, Jelena / Löfdahl, Lennart et al. | SAGE Publications | 2019
    Keywords: Engine encapsulation

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archive | 2006
    Keywords: Kapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    An ergonomics investigation into human thermal comfort using an automobile seat heated with encapsulated carbonized fabric (ECF)

    Brooks, J.E. / Parsons, K.C. | Tema Archive | 1999
    Keywords: Kapselung

    Watercraft enclosed lifeboats

    Tema Archive | 1976
    Keywords: KAPSELUNG

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archive | 2001
    Keywords: Verkapseln

    Reliability assessment of codlag system

    Tema Archive | 1985
    Keywords: VERKAPSELN

    Silent power transmission systems for modern ships

    Gerstner, J. / Gallin, C. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Development and testing of bio-inspired microelectromechanical pressure sensor arrays for increased situational awareness for marine vehicles

    Dusek, J. / Kottapalli, A.G.P. / Woo, M.E. et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Reliability considerations for switched mode power supplies for use in railway applications

    Allen, S.J. | Tema Archive | 1996
    Keywords: Verkapseln

    1990's whispering giants

    Mitchell, C. | Tema Archive | 1985
    Keywords: VERKAPSELN

    Microcoil speed position sensor for automotive applications

    Coulon, Y. de / Bourgeois, C. / Lambilly, H. de et al. | Tema Archive | 1997
    Keywords: Kapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    Dynamic microfactories co-encapsulating osteoblastic and adipose-derived stromal cells for the biofabrication of bone units

    Free access
    Nadine, Sara / Patrício, Sónia G. / Correia, Clara R. et al. | BASE | 2019
    Keywords: Cell Encapsulation

    Selecting enclosures for offshore usage

    Deavin, I. | Tema Archive | 1984
    Keywords: KAPSELUNG

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archive | 1996
    Keywords: Kapselung

    Motorola and MEMMS: the way up to a surface micromachined accelerometer

    Delpoux, A. | Tema Archive | 1997
    Keywords: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Skylab, part 3 - life-support systems

    Hopson, G.D. / Littles, J.W. / Patterson, W.C. | Tema Archive | 1972
    Keywords: SCHUTZART DRUCKFESTE KAPSELUNG

    The application of microtechnology to sensors for the automotive industry

    Smith, G. | Tema Archive | 1997
    Keywords: Verkapseln

    NEW PRODUCTS

    Online Contents | 2017
    Keywords: Encapsulation

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archive | 1997
    Keywords: Einkapselung

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Pneumatic capsule pipeline at Akima

    Kennedy, A. | Tema Archive | 1994
    Keywords: Verkapseln

    Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation

    Drewitz, H. / Stiglmaier, M. | Tema Archive | 1989
    Keywords: KAPSELUNG

    Prediction of thermal performance of wire-bonded plastic ball grid array package for underhood automotive applications

    Ramakrishna, K. / Trent, J.R. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres

    Bennett, A. | Tema Archive | 1983
    Keywords: KAPSELUNG

    P/M titanium reduces aerospace component costs

    Andersen, P.J. / Alber, N.E. / Thellmann, E.L. | Tema Archive | 1980
    Keywords: VERKAPSELN

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archive | 1998
    Keywords: Verkapseln

    A Critical Review on Assessment of Self Healing Performance of Bioconcrete

    Soda, Prabhath Ranjan Kumar / Mini, K. M. | Springer Verlag | 2023
    Keywords: Encapsulation procedure

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archive | 1997
    Keywords: Verkapseln

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Demonstrated reliability of plastic-encapsulated microcircuits for missile applications

    Sun Man Tam | Tema Archive | 1995
    Keywords: Kapselung

    An electrostatic accelerator for ultrahypervelocity microprojectiles

    Conte, D. / Turchi, P.J. / Bird, G. et al. | Tema Archive | 1991
    Keywords: KAPSELUNG

    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archive | 1990
    Keywords: KAPSELUNG

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