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encapsulation
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Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler
Simulation of modular mechatronic systems with application to vehicle dynamics
Multilayer alumina substrates for ECU (automotive electronics)
Optimal sizing of powder handling horizontal capsule pipelines
3-layered 3D flex based MCM: electrical characterization and reliability issues
Variable emissivity through MEMS technology
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Accelerated testing of flip chip packages under dynamic load
Model for BGA and CSP reliability in automotive underhood applications
The changing automotive environment: high-temperature electronics
Reliability potential of epoxy based encapsulants for automotive applications
Test method for availability of holes in height - temperature barrier on cementation process
A study of chip top delamination in plastic encapsulated packages under temperature loading
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Stability of spore-based biosensing systems under extreme conditions
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Thesound reduction index applied to automotive problems