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encapsulation
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Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Design and characteristics of submarine optical fiber cable
Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Reliability considerations for switched mode power supplies for use in railway applications
Source characterization of the lower front-end of a diesel engine
Motorola and MEMMS: the way up to a surface micromachined accelerometer
Long life radioisotopic power sources encapsulated in platinum metal alloys
Optimal sizing of powder handling horizontal capsule pipelines
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Optimized cooling systems for high-power semiconductor devices
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
The changing automotive environment: high-temperature electronics
Reliability potential of epoxy based encapsulants for automotive applications
Metal-enclosed, air-insulated traction switchgear - developments and applications
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Stability of spore-based biosensing systems under extreme conditions
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments
UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials
PV degradation curves: non‐linearities and failure modes