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encapsulation
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Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Metal-enclosed, air-insulated traction switchgear - developments and applications
UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Reliability potential of epoxy based encapsulants for automotive applications
Reliability considerations for switched mode power supplies for use in railway applications
Stability of spore-based biosensing systems under extreme conditions
Source characterization of the lower front-end of a diesel engine
Motorola and MEMMS: the way up to a surface micromachined accelerometer
Optimized cooling systems for high-power semiconductor devices
Long life radioisotopic power sources encapsulated in platinum metal alloys
Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
The changing automotive environment: high-temperature electronics
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Optimal sizing of powder handling horizontal capsule pipelines
PV degradation curves: non‐linearities and failure modes
Design and characteristics of submarine optical fiber cable
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications