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Synonyms were used for: encapsulation
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    UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials

    Witteck, Robert | Online Contents | 2017
    Keywords: encapsulation materials

    From cells to laminate: probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite element simulations

    Tippabhotla, Sasi Kumar | Online Contents | 2017
    Keywords: Encapsulation , encapsulation stress

    PV degradation curves: non‐linearities and failure modes

    Jordan, Dirk C | Online Contents | 2017
    Keywords: Encapsulation

    Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments

    Novoa, Fernando D | Online Contents | 2016
    Keywords: encapsulation debonding

    Intelligent energy management for a parallel hybrid electric vehicle in customer use

    Mustafa, Rashad | TIBKAT | 2015
    Keywords: Verkapseln

    The effect of cooling press on the encapsulation properties of crystalline photovoltaic modules: residual stress and adhesion

    Li, Heng‐Yu | Online Contents | 2015
    Keywords: encapsulation

    Encapsulations for organic devices and their evaluation using calcium corrosion tests

    Free access
    Klumbies, Hannes | TIBKAT | 2014
    Keywords: Verkapseln

    A Smart Reconfigurable Multi-sensor Multi-filter Navigation Engine with Modular Architecture Design for Plug-and-Play Navigation

    Atia, M.M. / Givigi, S. / Noureldin, A. et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Reliability assessment of molded Smart Power Modules

    Thomas, Tina / Becker, Karl-Friedrich / Dijk, Marius van et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Pre-development validation of an engine mounted encapsulation approach on SUV vehicle as 'Eco-Innovation' by means of EU Regulation 725/2011

    Petley, D. / Jansen, W. / Wicksteed, B. et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden

    Keller, Kevin | Tema Archive | 2011
    Keywords: verbesserte Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archive | 2011
    Keywords: Chip-Größen-Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010
    Keywords: Einkapselung

    Verkapselungstechnologien. Teilvorhaben. Abschlussbericht BMBF-Verbundvorhaben: CARO (Hocheffiziente und hochzuverlässige OLED-Devices für kundenspezifische Automobilanwendungen). Leitinnovation Organische Leuchtdioden. Laufzeit des Vorhabens: 01.03.2006 - 28.02.2009

    Kahle, Olaf / Langkabel, Eike | Tema Archive | 2009
    Keywords: Verkapselung

    Novel component packaging for high current applications using power semiconductor devices

    Weigeber, Volker / Hayes, Montry B. / Campbell, Robert J. et al. | Tema Archive | 2009
    Keywords: verbesserte Einkapselung

    Design limitations of powertrain electronics - automotive EMC challenges

    Kuvedu-Libla, J.R.K. | Tema Archive | 2009
    Keywords: Wärmehaushalt (Kapselung)

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)

    Simulation der thermischen Ankopplung von glasgekapselten Temperatursensoren an die Wicklung von elektrischen Maschinen

    Hegner, Holger / Riedler, Johann | Tema Archive | 2008
    Keywords: Kapselung

    Application of a systematic approach for the design of electrical motors type of protection flameproof enclosure

    Kim, Ha Dong | TIBKAT | 2007
    Keywords: Druckfeste Kapselung

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archive | 2007
    Keywords: Verkapseln

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archive | 2006
    Keywords: Kapselung

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archive | 2005
    Keywords: Wärmehaushalt (Kapselung)

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles

    Beckedahl, P. / Tursky, W. / Scheuermann, U. | Tema Archive | 2005
    Keywords: Verkapseln

    An improved, linear homopolar, electromagnetic launcher: STAR

    Nunnally, W.C. / Thompson, J.E. / Engel, T.G. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    New method for electrothermal simulations: HDTMOS in automotive applications

    Tounsi, P. / Dorkel, J.M. / Dupuy, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Maximizing lumen output of LEDs for automotive exterior signal lighting applications

    Conn, L.G. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Prediction of thermal performance of wire-bonded plastic ball grid array package for underhood automotive applications

    Ramakrishna, K. / Trent, J.R. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Thermal modeling of secondary lithium batteries for electric vehicle/hybrid electric vehicle applications

    Al-Hallaj, S. / Selman, J.R. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Assessment of high-heat-flux thermal management schemes

    Mudawar, I. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

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