Enabling technologies for achieving avionics modularization
Enabling technologies for achieving avionics modularization
- New search for: Blazej, D.C.
- New search for: Kurtz, B.E.
- New search for: Gollomp, B.P.
- New search for: Blazej, D.C.
- New search for: Kurtz, B.E.
- New search for: Gollomp, B.P.
A packaging approach is described which maximizes IC density and minimizes those complexities which degrade reliability. It emphasizes the reduction of parts count along with a high degree of functional integration to achieve these goals. The packaging and interconnection technologies required to maximize density and reliability are under development at Allied-Signal and through cooperative efforts with appropriate government agencies full-scale interconnect modules could be produced to verify performance. It is found that a single board implementation with no prepacked die is the optimum configuration. A module becomes a large hybrid circuit in the sense that it integrates several technologies on a single substrate.
Document information
Enabling technologies for achieving avionics modularization
Technologien fuer die Modularisierung in der Avionik
1988
Conference paper
English
Similar titles
Digital avionics and commercial devices - enabling technologies for a marriage
| British Library Conference Proceedings | 1994
Achieving the Benefits of Modular Avionics Design
| NTIS | 1982
Summary of avionics technologies
| IEEE | 2015
Avionics: Integrating Spacecraft Technologies
| NTRS | 1998