Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads

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Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads

Kothari, Rushabh / Sun, C.T.

Multifunctional structures, of various forms, are being used in aerospace industry and there have been increasing efforts to enhance their performance. The design and analysis of a composite sandwich beam embedded avionics and integrated cooling systems is presented in this article. The integrated electronics inside a sandwich beam reduces the overall weight of a vehicle by eliminating most of the avionics housing, cables, interconnects, etc. The foam core of a sandwich beam is modified with a cavity to embed avionics. Since the presence of a cavity degrades the strength of the structure, various methods of reinforcement have been presented. The heat dissipation system has been designed to protect the structure from excessive thermal loads. The design of heat dissipating system consists of two parts, thermal interface materials and a highly efficient heat transfer device. Design guidelines for a thermal interface material consisting of particulate composites are presented here. Among various choices, heat pipes have been chosen as the preferred heat transfer device. An example is given for an unmanned aerial vehicle skin acting as the heat sink to maintain embedded electronics within their operational limit at subsonic air speeds.