One limiting parameter for the application of MEMS in cars at places with elevated temperatures is the interconnect and wiring system of these devices. Currently used materials and technological concepts often are not sufficient for temperatures far above 125 Cel. This article attempts at first, to reflect main problems of device metallization at high temperatures. Finally, two application specific interconnect and wiring concepts are briefly introduced, which are able to work at temperatures up to 400 Cel and up to 500 Cel, respectively.


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    Title :

    Interconnect systems in automotive sensors at elevated temperatures


    Additional title:

    Steckersysteme fahrzeugspezifischer Sensoren für höhere Temperaturbereiche


    Contributors:
    Gottfried, K. (author) / Gessner, T. (author) / Kaufmann, C. (author)


    Publication date :

    2003


    Size :

    11 Seiten, 7 Bilder, 3 Tabellen, 14 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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