Adhesive bonding process for space structures

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Adhesive bonding process for space structures

Camahort, J.L. / Mulroy, P.D. / Mulroy, B.J. jun.

A method for the adhesive bonding of aerospace structures to optimize joint efficiency without introducing deleterious residual thermal stresses in a space environment is described. The process involves initially applying a high temperature curing film adhesive to the adherend surfaces to maximize surface energetics, and then bonding the adherends together with a room temperature curing adhesive to minimize residual thermal stresses in the bondline. The process is especially suited for bonding dissimilar thermal expansion materials, e.g. graphite/epoxy composites to metals, which will experience large thermal excursions in space. Lap shear strengths were measured at various temperatures on magnesium-to-composite specimens. Results are compared to conventional single adhesive applications. The integrity of double-adhesive bonded specimens after thermal cycling exposures (-30 F to +140 F) is also demonstrated. (Kursetz)