Corrosion Mechanisms of Copper and Gold Ball Bonds in Semiconductor Packages
Corrosion Mechanisms of Copper and Gold Ball Bonds in Semiconductor Packages
A Unification of Structure-Based Inference and Electrochemical Investigation
- New search for: Qin, Wentao
- New search for: Li, Yan
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- New search for: Qin, Wentao
Ball bonding is the most widely used interconnection method in microelectronic packages. It has enabled many modern technologies including medical implants, aerospace, automobiles and Internet of Things. In the automotive industry, driving automation and advanced driver assistance systems motivated mainly by safety enhancement are gaining traction. The reliabilities of these technologies necessitate those of the underlying ball bonds. This chapter provides interpretation of the mechanisms of corrosion that causes reliability failures of Cu and Au ball bonds, by unifying approaches based on microstructure characterization and electrochemical investigation. The corrosion of Cu ball bonds starts with pitting of the most Cu-rich layer (MCRL) under the chlorinated water layer, evolves into crevice corrosion, and can be assisted by stress corrosion cracking. In the MCRL, Al is preferentially oxidized, while the Cu atoms remain largely immune and coalesce to form nanoparticles. Four methods to address the corrosion are presented. Limited data indicate the same corrosion mechanisms for Au ball bonds.
Document information
Corrosion Mechanisms of Copper and Gold Ball Bonds in Semiconductor Packages
A Unification of Structure-Based Inference and Electrochemical Investigation
Advanced Driver Assistance Systems and Autonomous Vehicles ; Chapter : 15 ; 581-629
2022-10-28
49 pages
Article/Chapter (Book)
Electronic Resource
English
Automotive , Driving automation , Advanced driver assistance systems (ADAS) , Wire bonding , Copper ball bond , Gold ball bond , Interface , Intermetallic , Microstructures , Chlorine , Chloride ions , Corrosion , Electrochemical analyses , Corrosion potential , Pourbaix diagram , Crevice corrosion , Hydrogen embrittlement , Stress corrosion cracking (SCC) , Dealloying Engineering , Mechanical Engineering , Control, Robotics, Mechatronics , Artificial Intelligence , Computer Science
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