IC manufacture often has to meet stringent requirements pushing the imaging tools beyond their limits. Selection and optimization of steppers used to image patterns with critical dimensions at a fraction of wavelength has to consider tool’s aberration residue and the imaging tradeoffs of the patterned features. This report presents methodology to select tool-specific, multi-feature optima for imaging tools performing beyond their design points.


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    Title :

    Wavefront-based tool selection for critical level imaging


    Contributors:

    Conference:

    Optical Microlithography XVIII ; 2005 ; San Jose,California,United States


    Published in:

    Publication date :

    2004-05-12





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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