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    Title :

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer




    Publication date :

    1997



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    BKL:    53.36 Energiedirektumwandler, elektrische Energiespeicher
    Local classification TIB:    275/5670



    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997


    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995


    Flip-Chip Bonding of High-Speed Laser Diodes

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1996


    Flip-chip bonding of high-speed laser diodes

    Lindgren, S. / Ahlfeldt, H. / Kerzar, B. et al. | IEEE | 1996


    Miniaturized electron magnetic spectrometer

    Ho, G.C. | Online Contents | 2003