Advance in polymer technology yields composites having relatively low dielectric constants. Reduction achieved by reducing interactions between linear polyimide chains and by incorporation of fluorine into polymer backbones. Further reductions obtained by physically incorporating selected diamic acid additives into polyimides. Strong potential for use in microelectronics industry for fabrication of printed-circuit boards and fabrication of components for military aircraft.
Low-Dielectric-Constant Polyimide/Glass Composites
NASA Tech Briefs ; 18 , 4
1994-04-01
Miscellaneous
No indication
English
Low-Dielectric-Constant Polyimide Fibers
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