Techniques explored in search for rapid, reliable test. Resistances of aluminum/silicon contacts and methods to measure subjects of NASA report. Study with three tasks undertaken to evaluate nature and reliability of large numbers of semiconductor contacts of type now being fabricated in integrated circuits: Develop yield analysis for series strings of contacts using wafer-level electrical measurements, and identify different types of faults by visual inspection; develop wafer-level tests to evaluate reliability of contact strings; and develop mathematical model for current flow in contacts and examine contact region for evidence of micro-alloying.


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    Title :

    Study of Contact Resistances in Integrated Circuits


    Contributors:
    Buehler, M. G. (author) / Lambe, J. (author) / Suszko, S. F. (author)

    Published in:

    Publication date :

    1985-10-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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