Adhesive, developed for high-temperature components aboard satellites, is useful at both high and low temperatures and exhibits low-vacuum volatility and low shrinkage. System uses polyfunctional epoxy with high aromatic content, low equivalent weight, and more compact polymer than conventional bisphenol A tape.
New adhesive withstands temperature extremes
NASA Tech Briefs ; 3 , 1
1978-06-01
Miscellaneous
No indication
English
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