Adhesive, developed for high-temperature components aboard satellites, is useful at both high and low temperatures and exhibits low-vacuum volatility and low shrinkage. System uses polyfunctional epoxy with high aromatic content, low equivalent weight, and more compact polymer than conventional bisphenol A tape.


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    Title :

    New adhesive withstands temperature extremes


    Contributors:

    Published in:

    Publication date :

    1978-06-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English


    Keywords :



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