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    Title :

    Liquid Flux Assisted Bump Bonding Process And Thermal Design For Laser Arrays For Optical Interconnection


    Contributors:
    Yiu Man Wong, (author) / Chen, H. (author) / Kossives, D. (author) / Warning, F. (author) / Doherty, C.J. (author) / Mullally, T. (author) / Anthony, L.J. (author) / Lau, M. (author) / Frye, R. (author)


    Publication date :

    1993-01-01


    Size :

    103983 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Liquid Flux Assisted Bump Bonding Process and Thermal Design for Laser Arrays for Optical Interconnection

    IEEE; Lasers and Electro-Optics Society / IEEE; Components, Hybrids and Manufacturing Technology Society | British Library Conference Proceedings | 1993



    Parallel Optical Interconnection Using Surface Emitting Laser and Photodiode Arrays

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1993