We realized for the first time by a complete monolithic integration a bottom emitting laser OEIC including laser, monitor photodiode, and prism for SMT-packaging. This approach with the fabrication of the laser and reflection mirrors in full wafer technology exploits additionally the cost efficient advantages of on wafer facet preparation and on-wafer characterization.


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    Title :

    Bottom emitting 1.3 /spl mu/m BH-FP laser with integrated 45/spl deg/ reflector and monitor photodiode


    Contributors:
    Janiak, K. (author) / Albrecht, P. (author) / Fidorra, S. (author) / Heidrich, H. (author) / Rehbein, W. (author) / Roehle, H. (author) / Althaus, H.-L. (author)


    Publication date :

    2002-01-01


    Size :

    167066 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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