We have ablated holes in pre-thinned Si foils using an ultrafast laser. High resolution imaging of the edges of these holes reveal collateral damage limited to within 10 nanometers.


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    Title :

    Confining collateral damage to less than 10 nm during femtosecond laser machining


    Contributors:
    Picard, Y.N. (author) / Yalisove, S.M. (author) / Hsiao-hua Liu, (author) / Mourou, G. (author)


    Publication date :

    2004-01-01


    Size :

    301384 byte



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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