The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.
Cooling automotive power electronics
2024-06-04
Patent
Electronic Resource
English
IPC: | H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES / H01G Kondensatoren , CAPACITORS / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES |
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