Computational Analysis of Wire-Bonded Micro Heat Pipe: Influence of Thermophysical Parameters
Computational Analysis of Wire-Bonded Micro Heat Pipe: Influence of Thermophysical Parameters
- New search for: Rag, R. L.
- New search for: Sobhan, C. B.
- New search for: Peterson, G. P.
- New search for: Rag, R. L.
- New search for: Sobhan, C. B.
- New search for: Peterson, G. P.
A computational analysis was conducted to obtain the performance characteristics of wire-bonded micro heat pipes. A transient one-dimensional model, which incorporated the longitudinal variations in the liquid and vapor cross-sectional areas and the temperature-dependent thermophysical properties of the working fluid, was used in the analysis. The temperature distributions corresponding to various input heat fluxes and condenser heat transfer coefficients were obtained by solving the governing equations using a finite difference scheme. The effective thermal conductivity values were calculated using these to evaluate the performance of the device. The results were compared with those from previous models to obtain more realistic performance characteristics for the device.
Document information
Computational Analysis of Wire-Bonded Micro Heat Pipe: Influence of Thermophysical Parameters
Journal of Thermophysics and Heat Transfer ; 32 , 4 ; 925-932
2018-03-30
8 pages
Article (Journal)
Electronic Resource
English
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