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title: Proceedings of the Third ESA Electronic Components Conference
High Reliability Miniature Flexprint Connector for Deep Space Exposed Hardware
Gallium Arsenide MMIC Die Procurement for Space-Borne Payloads - Experiences and Issues
Gold Aluminium Intermetallics - Current and Future Considerations
Grain Boundary Sliding in Platinum Resistance Temperature Sensors
THX 7887A: et TH 7888A: deux nouveaux capteurs d'images CCD de 1024 x 1024 pixels et a fort debit
Recent Radiation Effects Activities at JPL: Coping with COTS
12000 Pixel Monolithic CCD Linear Image Sensor for High Resolution Instruments
Hot Carrier Reliability Simulation for CMOS Analog Circuits
Commercial Sampling Practice - for Space Industry Application
ERC 32 Radiation Tolerant RISC Processor; Tolerance to Radiation
CTS21 & CTC21: Solid Tantalum Capacitors for Switching Power Supplies and Converters
Known Good Die Techniques vs. Space Requirements. Phase A - KGD Survey