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Non-hermetic embedded MCM technologies for automotive and other lower cost applications
Research project for reducing the noise of truck Diesel engines
Concept for a chassis mounted capsule of engine and gearbox for heavy trucks
Jet Blast Resistance Experiment of Engineered Material Arresting System
Some aspects concerning noise reduction on diesel passenger cars
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
Some aspects concerning noise reduction of passenger cars with diesel and gasoline engines
Reduction in size and weight of electronic modules through the evolution of packaging design
An improved, linear homopolar, electromagnetic launcher: STAR
MEMS package in a harsh environment for aeronautic applications
High density packaging for automotive applications
Novel component packaging for high current applications using power semiconductor devices
On the isolation of science payloads from spacecraft vibrations
Assessment of high-heat-flux thermal management schemes
Test method for availability of holes in height - temperature barrier on cementation process
Multilayer alumina substrates for ECU (automotive electronics)
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Design limitations of powertrain electronics - automotive EMC challenges
A Novel Technology for Thermal Control for ISP module for Space Applications
Variable emissivity through MEMS technology
Memory chip packaging-an enabling technology for high-performance recce systems
New method for electrothermal simulations: HDTMOS in automotive applications