1–8 of 8 hits
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    New principle for front light systems in automotive applications

    Alt, T. / Ansorge, F. / Hanisch, H. et al. | Tema Archive | 2003
    , das die Umgebungsbedingungen im Automobil, Packungs- und Montierungsfragen des angestrebten Systems berührt. Unterschiedliche Optionen für die ...

    Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications

    Ansorge, F. / Wolter, J. / Hanisch, H. et al. | Tema Archive | 2002
    presents problem definitions and solutions for optical devices using micro-mirror reflector technology for mechatronic systems. To reduce package ...

    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archive | 2005
    given and a first design guideline for high temperature automotive flip chip applications is provided. ...
    Keywords: Kraftwagen

    Micro-mechatronics in automotive applications

    Ansorge, F. / Wolter, J. / Rebholz, C. et al. | Tema Archive | 2003
    system solutions and manufacturing technology for mechatronic systems, developed at Fraunhofer IZM MicroMechatronic Center. Special emphasis is ...

    Integration of micro-mechatronics in automotive applications

    Ansorge, F. / Becker, K.F. / Michel, B. et al. | Tema Archive | 2001
    presents system solutions and manufacturing technology for mechatronic systems, developed at Fraunhofer IZM. To reduce package volume, advanced ...

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    packaged components, as they increase packaging density and improve the reliability of electronic functions in a harsh environment. MCMs can ...
    Publisher: Institute of Electrical and Electronics Engineers (IEEE) , New York
    Keywords: Kraftwagen

    3D integration of image sensor SiP using TSV silicon interposer

    Wolf, M.Juergen / Zoschke, K. / Klumpp, A. et al. | Tema Archive | 2009
    . bare die) and testability. The paper discusses a specific 3D image sensor system for automotive applications. The system is based on wafer ...
    Keywords: Kraftwagen

    Einfluss von Virtual und Rapid Prototyping Prozessen auf Entwurf und Packaging mechatronischer Submodule

    Ansorge, F. / Michel, B. / Hanisch, H. et al. | Tema Archive | 2002
    components or functionalities, electronic components and the accompanying intelligence by appropriate software. An optimum at total functionality ...