Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly
The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation
Economic Sensitivity for End of Life Planning and Processing of Personal Computers
Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility
Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines
Neural Network Open Loop Control System for Wave Soldering
Optimization of PCB Component Placement Using Genetic Algorithms
Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique
Analytical Forced Convection Modeling of Plate Fin Heat Sinks
Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
Design Considerations of High Heat Flux Heat Pipe Evaporators
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Electronic Products at their End-of-Life: Options and Obstacles