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Dielectric isolation techniques in high-temperature electronics
Stainless steel bipolar plates for direct methanol fuel cells (DMFC)
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
In-depth characterization of die attach adhesive for low-k automotive device application
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Industry Invests in the Gold Standard for Ultimate Reliability
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
A new Ag/Pd conductor for automotive applications
3-layered 3D flex based MCM: electrical characterization and reliability issues
Alternative solders for flip chip applications in the automotive environment