Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Design Considerations of High Heat Flux Heat Pipe Evaporators
Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Electronic Products at their End-of-Life: Options and Obstacles