11–20 of 179 hits
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    Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates

    Pan, J. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding

    Zhong, Z. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

    Lu, D. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Printed Circuit Board Manufacturing and Testing of RIMM[TM]

    Lau, J. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Turbulent Flow and Heat Transfer Over Heated Modules for a Wide Range of Reynolds Numbers and Module Size

    Deb, P. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage

    Giachetti, R. E. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Design Considerations of High Heat Flux Heat Pipe Evaporators

    Zuo, Z.J. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects

    Ng, E.Y.K. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Analysis of Design Efficiency for the Disassembly of Modular Electronic Products

    Veerakamolmal, P. | Online Contents | 1999
    Publisher: World Scientific , Singapore

    Electronic Products at their End-of-Life: Options and Obstacles

    Linton, J. | Online Contents | 1999
    Publisher: World Scientific , Singapore