ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications
An Iterative Algorithm for Shape Registration
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
Application of ink screening models to solder paste printing in SMT assembly
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
Application of sliding mode control to spot bead welding mobile robot using camera sensor
Application of Traffic Flow Models
Applications of electrorheological fluid in shock absorbers