51–60 of 393 hits
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    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995
    Publisher: World Scientific , Singapore

    Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

    Noort, H. M. | Online Contents | 1995
    Publisher: World Scientific , Singapore

    An Iterative Algorithm for Shape Registration

    Lu, F. / Milios, E. / University of Naples et al. | British Library Conference Proceedings | 1994
    Publisher: World Scientific

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Publisher: World Scientific , Singapore

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Publisher: World Scientific , Singapore

    Application of sliding mode control to spot bead welding mobile robot using camera sensor

    Chung, Tan Lam / Park, Soon Sil / Bui, Trong Hieu et al. | Tema Archive | 2004
    Publisher: World Scientific , Singapore

    Application of Traffic Flow Models

    Brilon, W. / Ponzlet, M. / German Supercomputing Center HLRZ | British Library Conference Proceedings | 1996
    Publisher: World Scientific

    Applications of electrorheological fluid in shock absorbers

    Wei, Chenguan / Fu Zhao | Tema Archive | 1994
    Publisher: World Scientific , Singapore