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Development of microlens arrays for high-speed optical communication [5454-14]
High-density hybrid interconnect technologies (Invited Paper) [5454-01]
Sol-gel replication of optical components suited for surface mount assembly [5454-06]
Unglue bonding of glassceramic parts with ultralow coefficient of thermal expansion [5454-17]
Large-area origination and replication of microstructures with optical functions [5454-15]
Assembly of electro-optical modules in a desktop factory [5454-11]
Flip-chip assembly and reliability using gold/tin solder bumps [5454-03]
Sealing optical fibers without metallization: design guidelines [5454-13]
Flip-chip assembly for photonic circuits [5454-02]
A cost-effective packaging for the environmental hardening of passive optical devices [5454-12]
Active ring resonators based on GaInAsP/InP (Invited Paper) [4947-25]
High-brightness 1040-nm tapered diode lasers [4947-29]