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Litton's LN-210: A State of the Art Heading and Attitude Reference System
Embedded Military GPS Provides Low Cost Navigator
Longbow Apache Interior Primary Lighting System
Simulation Evaluation of a Pilot Interface with an Automated Rotorcraft Obstacle Avoidance System
The AH-64D Longbow Apache Hot Bench
Digitizing the Battlefield - Impact on Avionics
Helmet Mounted Display with High Integrity
Simulation from Discrete Signal to 1553 Data Bus: A Low Cost Design in the Longbow Apache Hot Bench
Integrating a Radar/ESM Antenna Suite with the S-70 Helicopter
A Three-Dimensional Optical Interconnection Network for Fine-Grain Parallel Architectures
Simulation Tools for Free-Space Optical Interconnects Based on Computer-Generated Holograms
Rapid Prototyping of Photonic Integrated Circuits
Optoelectronic Integration of Thin Film Devices for Photonic Interconnect
CAD of Solder Joints for Self-Aligned Assemblies
Hybrid Integration of AlGaAs/GaAs Laser Diode on Si Substrate
Waveguide and Diffractive Coupling Elements for Optoelectronic Packaging
Hybrid Integration of Electrical and Optical Interconnect for MCMs Applications
Direction of Optoelectronics Research at ARPA
Optical and Package Design Issues for Chip-to-Chip Free-Space Optical Interconnections
Fabrication Issues for Free-Space Optics at the Board Packaging Level
Consortium for Optical and Optoelectronic Technologies for Computing
Alignment Considerations in the Package Design of Optical Interconnections
Thin Film Resonant Cavity Enhanced Photodetectors
30% External Quantum Efficiency From Surface Textured, Thin-Film Light-Emitting-Diode Arrays
20-channel Optoelectronic Receiver for Free-Space Optical Interconnection
Solder Bonded Optoelectronic Transceiver Components
Expectations from Optoelectronic Technologies
Integrated Optical Heads for Optical Data Storage
Direct Dispensing of Polymer Waveguides on Silicon Substrates
Dispensed Dual-Polymer Waveguides on Silicon V-Grooves
U.S.-Japan Joint Optoelectronics Project
Demonstration of GaAs LEDs on SI Chips Using Epitaxial Liftoff
Packaging of Liquid Crystal on Silicon Modulators Using Solder
GaAs 850nm Surface-normal Modulators Solder-bonded to Silicon
Prototype Optically Interconnected Multichip Module with Holographic Optical Interconnects
Results of OEMCM Packaging Efforts at LLNL
Flight Deck Automation: Problems and Concerns as Reported in the Aviation Safety Reporting System
Collaborative Strategies in Air-Ground Communication
CREW (Complement Regimes Evaluated for Warships)
A Taxonomic Analysis of Terminal Air Traffic Control/Pilot Communications
Development and Test of a Pilot Display for Surface Operations
Flight Deck Crew Alerting: Problems and Concerns as Reported in the Aviation Safety Reporting System
Superimposed Symbology: Attentional Problems and Design Solutions
Standardizing Interactive Display Functions on the 777 Flight Deck