1200 V 6 A SiC BJTs with very Low VCESAT and Fast Switching
Thermoelectric Cooling for Power Density Maximisation of Power Electronics Converters
Novel Silver Contact Paste; Lead Free Solution for Die Attach
Design of a Multi-Cell, DCM PFC-Rectifier for a 1mm Thick, 200W Off-Line Power Supply
Importance of Boundary Conditions for Optimizing the Thermal Dimensioning of PCB Traces
Normally-On SiC JFETs in Power Converters: Gate Driver and Safe Operation
Observation of Chip Solder Degradation by Electrical Measurements during Power Cycling
Thermal Pre-Dimensioning Methodology based on Thermal Impedance
Non Destructive SOA Testing of Power Modules (Invited paper)
Power Electronics System Integration for Electric and Hybrid Vehicles (Invited paper)
SiC BJT Driver Applied to a 2 kW Inverter: Performances and Limitations
Keynote: Performance, Trends and Limitations of Power Electronics Systems