Synonyms were used for: Kraftfahrzeugelektronik
Search without synonyms: keywords:("Kraftfahrzeugelektronik")

1–16 of 16 hits
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    Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications

    Ansorge, F. / Wolter, J. / Hanisch, H. et al. | Tema Archive | 2002
    Keywords: Kraftfahrzeugelektronik

    Micro-mechatronics in automotive applications

    Ansorge, F. / Wolter, J. / Rebholz, C. et al. | Tema Archive | 2003
    Keywords: Kraftfahrzeugelektronik

    Modellierung und Anwendung von Silizium-Mikrofonsystemen

    Mammen, Heinz-Theo / Stürmer, Uwe / Köhne, H. et al. | Tema Archive | 2005
    Keywords: Kraftfahrzeugelektronik

    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archive | 2002
    Keywords: Kraftfahrzeugelektronik

    Integration of micro-mechatronics in automotive applications

    Ansorge, F. / Becker, K.F. / Michel, B. et al. | Tema Archive | 2001
    Keywords: Kraftfahrzeugelektronik

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Kraftfahrzeugelektronik

    3D integration of image sensor SiP using TSV silicon interposer

    Wolf, M.Juergen / Zoschke, K. / Klumpp, A. et al. | Tema Archive | 2009
    Keywords: Kraftfahrzeugelektronik

    New principle for front light systems in automotive applications

    Alt, T. / Ansorge, F. / Hanisch, H. et al. | Tema Archive | 2003
    Keywords: Kraftfahrzeugelektronik

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: Kraftfahrzeugelektronik

    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archive | 2005
    Keywords: Kraftfahrzeugelektronik

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Kraftfahrzeugelektronik

    Multichip modules for automotive applications

    Simsek, A. / Strohschein, W. / Reichl, H. | Tema Archive | 1999
    Keywords: Kraftfahrzeugelektronik

    The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach

    Jung, E. / Kasulke, P. / Giebler, R. et al. | Tema Archive | 1997
    Keywords: Kraftfahrzeugelektronik

    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archive | 1998
    Keywords: Kraftfahrzeugelektronik

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Kraftfahrzeugelektronik

    Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

    Ansorge, F. / Becker, K.F. / Ehrlich, R. et al. | Tema Archive | 1997
    Keywords: Kraftfahrzeugelektronik