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Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
Design limitations of powertrain electronics - automotive EMC challenges
Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
A Novel Technology for Thermal Control for ISP module for Space Applications
Source characterization of the lower front-end of a diesel engine
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Motorola and MEMMS: the way up to a surface micromachined accelerometer
Optimized cooling systems for high-power semiconductor devices
Skylab, part 3 - life-support systems
New method for electrothermal simulations: HDTMOS in automotive applications
Variable emissivity through MEMS technology
The application of microtechnology to sensors for the automotive industry
Memory chip packaging-an enabling technology for high-performance recce systems
Initial performance of advanced designs for IPV nickel-hydrogen cells
Thesound reduction index applied to automotive problems
Long life radioisotopic power sources encapsulated in platinum metal alloys
Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Performance of new silicone adhesives and encapsulants at high and low temperatures
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
High temperature, high power density packaging for automotive applications