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Reduktion der Kältemittelfüllmenge im Pkw durch den Einsatz von kompakten Kältemittelkreisläufen
Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
Thesound reduction index applied to automotive problems
Jet Blast Resistance Experiment of Engineered Material Arresting System
High density packaging for automotive applications
A Novel Technology for Thermal Control for ISP module for Space Applications
Novel component packaging for high current applications using power semiconductor devices
Design limitations of powertrain electronics - automotive EMC challenges
Innovatives Wärmemanagement - ein Schlüssel zur Reduzierung der CO2- Emissionen im Fahrzeug
MEMS package in a harsh environment for aeronautic applications
Akustisch optimierte Zusatzmaßnahmen auf einer blasgeformten Motorkapsel
Technologien zur funktionellen Integration von Akustik, Aerodynamik und Wärmemanagement
Test method for availability of holes in height - temperature barrier on cementation process
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Ein neuer Außengeräuschprüfstand im Entwicklungsprozess bei BMW
Optimierung eines Fahrzeugkühlsystems für instationären Betrieb
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Möglichkeiten zur Schallreduzierung bei Deckeln und Hauben
An improved, linear homopolar, electromagnetic launcher: STAR
Thermal characterization of a mercury arc lamp for a projection display system
New method for electrothermal simulations: HDTMOS in automotive applications
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
High temperature, high power density packaging for automotive applications
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Model for BGA and CSP reliability in automotive underhood applications
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Assessment of high-heat-flux thermal management schemes
Thermal management for high performance computing in spaceborne applications
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process