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    Assessment of High-Temperature Encapsulants for Planar Packages

    Boroyevich, Dushan / Lu, Guo-quan / Seshadri, Jayashree et al. | SAE Technical Papers | 2010

    250 °C SiC Power Module Package Design

    Huff, Daniel / Wang, Fred / Ngo, Khai D. T. et al. | SAE Technical Papers | 2008

    A Self-Powered Wireless Active Acoustic Liner

    Kadirvel, Selvi / Liu, Fei / Horowitz, Stephen et al. | AIAA | 2006